Alumni
Jiao Lishi
Femtosecond laser drilling micro-TSV with high aspect ratio on silicon wafer. Femtosecond laser clean etching on silicon wafer. Numerical simulation of ultrafast heat transfer analyzed using commercial multi-physics, COMSOL.
Research profile
Femtosecond laser drilling micro-TSV with high aspect ratio on silicon wafer. Femtosecond laser clean etching on silicon wafer. Numerical simulation of ultrafast heat transfer analyzed using commercial multi-physics, COMSOL.
Notes
1. L.S. Jiao, E.Y.K. Ng, L.M. Wee and H.Y. Zheng, “Refining femtosecond laser induced periodical surface structures with liquid assist” Applied Surface Science, 2013, vol 264 , pp. 56-55